ASMPT Semiconductor Solutions
- LED Micro and Mini assembly
- Wafer Separation
- Encapsulation Solutions Equipment
- AOI/FOL Equipment
- Singulation, Trim & Form System
- CIS Equipment
- Die Attach Equipment
- LED Testing, Sorting & Taping System
- Factory Automation
- Wire Bonding Equipment - ball and wedge bonders
- Dispensing Systems
- Test & Finish Handling System